L-PFC etching

 

Plasma etching has been widely applied in nano patterning processes for precise pattern transfer. Purfluoro carbon (PFC) based gas has been widely used for nanopatterning. However, PFC gas has a global warming potential (GWP) of over 8,000, which has a significant negative impact on the ozone layer. Therefore, in order to overcome environmental problems, the process applicability of liquefied PFC gas with low GWP value needs to be further studied. Through this study, plasma etching results of conventional gaseous gas and liquefied gas, which is an alternative gas, are compared. Therefore, we examine the applicability of liquefied gas to the semiconductor industry.